Please use this identifier to cite or link to this item: http://hdl.handle.net/2445/125255
Full metadata record
DC FieldValueLanguage
dc.contributor.advisorFraile Rodríguez, Arantxa-
dc.contributor.authorRodriguez Alvarez, Javier-
dc.date.accessioned2018-10-10T12:06:32Z-
dc.date.available2018-10-10T12:06:32Z-
dc.date.issued2018-06-
dc.identifier.urihttp://hdl.handle.net/2445/125255-
dc.descriptionTreballs Finals de Grau de Física, Facultat de Física, Universitat de Barcelona, Curs: 2018, Tutora: Arantxa Fraile Rodríguezca
dc.description.abstractThe system formed by a 10 nm thin film of Ni and a 10 μm-thick V2O3 layer shows a reversible enhancement of the coercivity (∼300%) due to the structural phase transition (metal/insulator) of the V2O3layer. Performing micromagnetic simulations and comparing the results with experimental data we have studied the coupling mechanism on the Ni/V2O3 interface. We have proven that this coupling is responsible for the coercivity enhancement and that the magnetisation domains in the Ni do not follow exactly the metal/insulator domains on the V2O3. Finally, we have determined that the results of the simulations are in agreement with a phase coexistence in V2O3.ca
dc.format.extent5 p.-
dc.format.mimetypeapplication/pdf-
dc.language.isoengca
dc.rightscc-by-nc-nd (c) Rodríguez, 2018-
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es/*
dc.sourceTreballs Finals de Grau (TFG) - Física-
dc.subject.classificationMaterials magnèticscat
dc.subject.classificationSimulació per ordinadorcat
dc.subject.classificationTreballs de fi de graucat
dc.subject.otherMagnetic materialseng
dc.subject.otherComputer simulationeng
dc.subject.otherBachelor's theseseng
dc.titleMicromagnetic simulations of magnetoelastic heterostructureseng
dc.typeinfo:eu-repo/semantics/bachelorThesisca
dc.rights.accessRightsinfo:eu-repo/semantics/openAccessca
Appears in Collections:Treballs Finals de Grau (TFG) - Física

Files in This Item:
File Description SizeFormat 
Rodriguez Álvarez Javier.pdf2.93 MBAdobe PDFView/Open


This item is licensed under a Creative Commons License Creative Commons