Please use this identifier to cite or link to this item: http://hdl.handle.net/2445/9522
Full metadata record
DC FieldValueLanguage
dc.contributor.authorCosta, J. M.cat
dc.contributor.authorSagués i Mestre, Francesccat
dc.contributor.authorVilarrasa, M.cat
dc.date.accessioned2009-10-06T08:31:46Z-
dc.date.available2009-10-06T08:31:46Z-
dc.date.issued1991cat
dc.identifier.issn1050-2947cat
dc.identifier.urihttp://hdl.handle.net/2445/9522-
dc.description.abstractExperiments are reported on fractal copper electrodeposits. An electrochemical cell was designed in order to obtain a potentiostatic control on the quasi-two-dimensional electrodeposition process. The aim was focused on the analysis of the growth rate of the electrodeposited phase, in particular its dependence on the electrode potential and electrolyte concentration.eng
dc.format.extent4 p.cat
dc.format.mimetypeapplication/pdfeng
dc.language.isoengeng
dc.publisherThe American Physical Societycat
dc.relation.isformatofReproducció digital del document publicat en format paper, proporcionada per PROLA i http://dx.doi.org/10.1103/PhysRevA.43.7057cat
dc.relation.ispartofPhysical Review A, 1991, vol. 43, núm. 12, p. 7057-7060.cat
dc.relation.urihttp://dx.doi.org/10.1103/PhysRevA.43.7057-
dc.rights(c) The American Physical Society, 1991cat
dc.sourceArticles publicats en revistes (Ciència dels Materials i Química Física)-
dc.subject.classificationElectroquímicaca
dc.subject.classificationDeposició (Metal·lúrgia)ca
dc.subject.otherElectrochemistryeng
dc.subject.otherPlatingeng
dc.titleGrowth rate of fractal copper electrodeposits: Potential and concentration effectseng
dc.typeinfo:eu-repo/semantics/articleeng
dc.typeinfo:eu-repo/semantics/publishedVersion-
dc.identifier.idgrec54928cat
dc.rights.accessRightsinfo:eu-repo/semantics/openAccess-
Appears in Collections:Articles publicats en revistes (Ciència dels Materials i Química Física)

Files in This Item:
File Description SizeFormat 
54928.pdf594.67 kBAdobe PDFView/Open


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.