Please use this identifier to cite or link to this item:
Title: Excimer laser induced deposition of copper from Cu(hfac)(TMVS)
Author: Izquierdo, Ricardo
Bertomeu i Balagueró, Joan
Suys, Marc
Sacher, Edward
Meunier, Michel
Keywords: Coure
Pel·lícules metàl·liques
Metallic films
Issue Date: 1995
Publisher: Elsevier B.V.
Abstract: Copper films have been deposited on TiN and fluoropolymer substrates from the KrF excimer-laser-assisted decomposition of Cu(hfac)(TMVS). Using H2 as the carrier gas, very uniform, shiny metal-like films were deposited with grain size of 50 to 100 nm. XPS measurements show that the precursor is reduced to metallic copper, and that a Cu/C atomic ratio of up to 17 is obtained.
Note: Versió postprint del document publicat a:
It is part of: Applied Surface Science, 1995, vol. 86, num. 1-4, p. 509-513
Related resource:
ISSN: 0169-4332
Appears in Collections:Articles publicats en revistes (Física Aplicada)

Files in This Item:
File Description SizeFormat 
114375.pdf600.88 kBAdobe PDFView/Open

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.