1. Dipòsit Digital de la Universitat de Barcelona
  2. Recerca
  3. Ciència dels Materials i Química Física
  4. Articles publicats en revistes (Ciència dels Materials i Química Física)
Please use this identifier to cite or link to this item: http://hdl.handle.net/2445/139539
Full metadata record
DC FieldValueLanguage
dc.contributor.authorSebastián, Paula-
dc.contributor.authorGómez, Elvira-
dc.contributor.authorCliment Paya, Victor Jose-
dc.contributor.authorFeliu, Juan M.-
dc.date.accessioned2019-09-09T07:13:03Z-
dc.date.available2019-09-09T07:13:03Z-
dc.date.issued2017-03-31-
dc.identifier.issn1388-2481-
dc.identifier.urihttp://hdl.handle.net/2445/139539-
dc.description.abstractCopper electrodeposition on polycrystalline gold electrode and on Au(hkl) single crystals was investigated in a deep eutectic solvent (DES). The employed DES consisted on a mix of choline chloride and urea (1:2). The interface Au(hkl) /DES was studied by using cycling voltammetry in the capacitive region. The blank voltammograms showed characteristic features, not previously reported, that demonstrates the surface sensitivity of this solvent. Afterwards, copper electrodeposition was analyzed, finding that it takes place through the formation of a UPD adlayer, evidencing the surface sensitivity of the phenomena. Voltammetric profiles showed similarities with those obtained in aqueous solutions containing chloride, suggesting that the copper UPD in this DES is strongly influenced by the presence of chloride.-
dc.format.extent5 p.-
dc.format.mimetypeapplication/pdf-
dc.language.isoeng-
dc.publisherElsevier B.V.-
dc.relation.isformatofVersió postprint del document publicat a: https://doi.org/10.1016/j.elecom.2017.03.020-
dc.relation.ispartofElectrochemistry Communications, 2017, vol. 78, p. 51-55-
dc.relation.urihttps://doi.org/10.1016/j.elecom.2017.03.020-
dc.rightscc-by-nc-nd (c) Elsevier B.V., 2017-
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es-
dc.sourceArticles publicats en revistes (Ciència dels Materials i Química Física)-
dc.subject.classificationSolucions iòniques-
dc.subject.classificationDissolvents-
dc.subject.classificationCoure-
dc.subject.classificationOr-
dc.subject.otherIonic solutions-
dc.subject.otherSolvents-
dc.subject.otherCopper-
dc.subject.otherGold-
dc.titleCopper underpotential deposition at gold surfaces in contact with a deep eutectic solvent: new insights-
dc.typeinfo:eu-repo/semantics/article-
dc.typeinfo:eu-repo/semantics/acceptedVersion-
dc.identifier.idgrec671078-
dc.date.updated2019-09-09T07:13:03Z-
dc.rights.accessRightsinfo:eu-repo/semantics/openAccess-
Appears in Collections:Articles publicats en revistes (Ciència dels Materials i Química Física)

Files in This Item:
File Description SizeFormat 
671078.pdf1.76 MBAdobe PDFView/Open
Show simple item record


This item is licensed under a Creative Commons License Creative Commons