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http://hdl.handle.net/2445/140382
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DC Field | Value | Language |
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dc.contributor.author | Serrà i Ramos, Albert | - |
dc.contributor.author | Coleman, Simon J. | - |
dc.contributor.author | Gómez, Elvira | - |
dc.contributor.author | Green, Todd A. | - |
dc.contributor.author | Vallés Giménez, Elisa | - |
dc.contributor.author | Vilana i Balastegui, Joan | - |
dc.contributor.author | Roy, Sudipta | - |
dc.date.accessioned | 2019-09-18T09:47:59Z | - |
dc.date.available | 2019-09-18T09:47:59Z | - |
dc.date.issued | 2016-04-30 | - |
dc.identifier.issn | 0013-4686 | - |
dc.identifier.uri | http://hdl.handle.net/2445/140382 | - |
dc.description.abstract | The EnFACE technology has been demonstrated as a successful mask-less electrodeposition method to transfer millimetre and micrometre-scale copper patterns on to A7-sized rectangular plates. This is the first successful demonstration of this technique using large substrates. A patterned anode tool was used to transfer electrodepositedpatterns onto anun-patterned cathode by maintaining very narrow separation (300 µm) between the two electrodes and agitating the fluid in the inter-electrode gap by ultrasonic means. A non-acidic copper solution with a low content of metal ions and additives was used.Limiting current experiments were initially performed to demonstrate that improved and uniform agitation could be maintained within the inter-electrode gap at relatively low ultrasonic powers of 5 to 30 W L-1. The best pattern definition was obtained at a US power of 5 W L-1and a current density of 20 mA cm-2. Importantly, the resultsobtained were comparable to those obtained by conventional through-mask plating. A single anode tool could be used to pattern up to five substrates, substantially minimising the amount of lithographic processingrequired. These results suggest that the EnFACE techniqueis a usefulmask-less microfabrication process for pattern transfer on to large substrates. | - |
dc.format.extent | 11 p. | - |
dc.format.mimetype | application/pdf | - |
dc.language.iso | eng | - |
dc.publisher | Elsevier Ltd | - |
dc.relation.isformatof | Versió postprint del document publicat a: https://doi.org/10.1016/j.electacta.2016.04.003 | - |
dc.relation.ispartof | Electrochimica Acta, 2016, vol. 207, p. 207-217 | - |
dc.relation.uri | https://doi.org/10.1016/j.electacta.2016.04.003 | - |
dc.rights | cc-by-nc-nd (c) Elsevier Ltd, 2016 | - |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/es | - |
dc.source | Articles publicats en revistes (Ciència dels Materials i Química Física) | - |
dc.subject.classification | Coure | - |
dc.subject.classification | Galvanoplàstia | - |
dc.subject.classification | Microestructura | - |
dc.subject.other | Copper | - |
dc.subject.other | Electroplating | - |
dc.subject.other | Microstructure | - |
dc.title | Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method | - |
dc.type | info:eu-repo/semantics/article | - |
dc.type | info:eu-repo/semantics/acceptedVersion | - |
dc.identifier.idgrec | 659251 | - |
dc.date.updated | 2019-09-18T09:47:59Z | - |
dc.rights.accessRights | info:eu-repo/semantics/openAccess | - |
Appears in Collections: | Articles publicats en revistes (Ciència dels Materials i Química Física) |
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File | Description | Size | Format | |
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659251.pdf | 523.19 kB | Adobe PDF | View/Open |
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