Please use this identifier to cite or link to this item: http://hdl.handle.net/2445/195364
Title: Impact of the RF Power on the Copper Nitride Films Deposited in a Pure Nitrogen Environment for Applications as Eco-Friendly Solar Absorber
Author: Rodríguez Tapiador, Maria Isabel
Merino, J.
Jawhari, Tariq
Muñoz Rosas, A.L.
Bertomeu, J.
Fernández, Susana
Keywords: Cèl·lules fotovoltaiques
Coure
Photovoltaic cells
Copper
Issue Date: 10-Feb-2023
Publisher: MDPI
Abstract: This material can be considered to be an interesting eco-friendly choice to be used in the photovoltaic field. In this work, we present the fabrication of Cu3N thin films by reactive radio-frequency (RF) magnetron sputtering at room temperature, using nitrogen as the process gas. Dif-ferent RF power values ranged from 25 to 200 W and gas pressures of 3.5 and 5 Pa were tested to determine their impact on the film properties. The morphology and structure were exhaustively examined by Atomic Force Microscopy (AFM), Fourier Transform Infrared (FTIR) and Raman Spec-troscopies and X-ray Diffraction (XRD), respectively. The AFM micrographs revealed different mor-phologies depending on the total pressure used, and rougher surfaces when the films were depos-ited at the lowest pressure; whereas FTIR and Raman spectra exhibited the characteristics bands related to the Cu-N bonds of Cu3N. Such bands became narrower as the RF power increased. XRD patterns showed the (100) plane as the preferred orientation, that changed to (111) with the RF power, revealing a worsening in structural quality. Finally, the band gap energy was estimated from transmission spectra carried out with a Perkin Elmer 1050 spectrophotometer to evaluate the suita-bility of Cu3N as a light absorber. The values obtained demonstrated the capability of Cu3N for solar energy conversion applications, indicating a better film performance under the sputtering condi-tions 5.0 Pa and RF power values ranged from 50 to 100 W.
Note: Reproducció del document publicat a: https://doi.org/10.3390/ma16041508
It is part of: Materials, 2023, vol. 16, num. 4, p. 1508-1-1508-19
URI: http://hdl.handle.net/2445/195364
Related resource: https://doi.org/10.3390/ma16041508
ISSN: 1996-1944
Appears in Collections:Articles publicats en revistes (Física Aplicada)

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