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http://hdl.handle.net/2445/9522| Title: | Growth rate of fractal copper electrodeposits: Potential and concentration effects |
| Author: | Costa, J. M. Sagués i Mestre, Francesc Vilarrasa, M. |
| Keywords: | Electroquímica Deposició (Metal·lúrgia) Electrochemistry Plating |
| Issue Date: | 1991 |
| Publisher: | The American Physical Society |
| Abstract: | Experiments are reported on fractal copper electrodeposits. An electrochemical cell was designed in order to obtain a potentiostatic control on the quasi-two-dimensional electrodeposition process. The aim was focused on the analysis of the growth rate of the electrodeposited phase, in particular its dependence on the electrode potential and electrolyte concentration. |
| Note: | Reproducció digital del document publicat en format paper, proporcionada per PROLA i http://dx.doi.org/10.1103/PhysRevA.43.7057 |
| It is part of: | Physical Review A, 1991, vol. 43, núm. 12, p. 7057-7060. |
| URI: | http://hdl.handle.net/2445/9522 |
| Related resource: | http://dx.doi.org/10.1103/PhysRevA.43.7057 |
| ISSN: | 1050-2947 |
| Appears in Collections: | Articles publicats en revistes (Ciència dels Materials i Química Física) |
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