Please use this identifier to cite or link to this item: http://hdl.handle.net/2445/55245
Title: The maximum voltage drop in an on-chip power distribution network: analysis of square, triangular and hexagonal power pad arrangements
Author: Carroll, Tom
Ortega Cerdà, Joaquim
Keywords: Arquitectura d'ordinadors
Funcions el·líptiques
Integrals
Computer architecture
Elliptic functions
Integrals
Issue Date: 23-Apr-2014
Publisher: Cambridge University Press
Abstract: A mathematical model of the voltage drop which arises in on-chip power distribution networks is used to compare the maximum voltage drop in the case of different geometric arrangements of the pads supplying power to the chip. These include the square or Manhattan power pad arrangement, which currently predominates, as well as equilateral triangular and hexagonal arrangements. In agreement with the findings in the literature and with physical and SPICE models, the equilateral triangular power pad arrangement is found to minimize the maximum voltage drop. This headline finding is a consequence of relatively simple formulas for the voltage drop, with explicit error bounds, which are established using complex analysis techniques, and elliptic functions in particular.
Note: Reproducció del document publicat a: 10.1017/S0956792514000114
It is part of: European Journal of Applied Mathematics, 2014, p. 1-21
Related resource: http://dx.doi.org/10.1017/S0956792514000114
URI: http://hdl.handle.net/2445/55245
ISSN: 0956-7925
Appears in Collections:Articles publicats en revistes (Matemàtiques i Informàtica)

Files in This Item:
File Description SizeFormat 
635209.pdf483.65 kBAdobe PDFView/Open


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.