Please use this identifier to cite or link to this item: http://hdl.handle.net/2445/8745
Title: Dynamic compact thermal models with multiple power sources: application to an ultrathin chip stacking technology
Author: Palacín Roca, Jordi
Salleras, Marc
Samitier i Martí, Josep
Marco Colás, Santiago
Keywords: Microelectrònica
Dynamic compact thermal models
Modeling
Thin electronics
Issue Date: 2005
Publisher: IEEE
Abstract: Whereas numerical modeling using finite-element methods (FEM) can provide transient temperature distribution in the component with enough accuracy, it is of the most importance the development of compact dynamic thermal models that can be used for electrothermal simulation. While in most cases single power sources are considered, here we focus on the simultaneous presence of multiple sources. The thermal model will be in the form of a thermal impedance matrix containing the thermal impedance transfer functions between two arbitrary ports. Each individual transfer function element ( ) is obtained from the analysis of the thermal temperature transient at node ¿ ¿ after a power step at node ¿ .¿ Different options for multiexponential transient analysis are detailed and compared. Among the options explored, small thermal models can be obtained by constrained nonlinear least squares (NLSQ) methods if the order is selected properly using validation signals. The methods are applied to the extraction of dynamic compact thermal models for a new ultrathin chip stack technology (UTCS).
Note: Reproducció del document publicat a http://dx.doi.org/10.1109/TADVP.2005.850507
It is part of: IEEE Transactions on Advanced Packaging, 2005, vol. 28, núm. 4, p. 694-703.
URI: http://hdl.handle.net/2445/8745
ISSN: 1521-3323
Appears in Collections:Articles publicats en revistes (Electrònica)

Files in This Item:
File Description SizeFormat 
517594.pdf721.11 kBAdobe PDFView/Open


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.