Please use this identifier to cite or link to this item: http://hdl.handle.net/2445/9522
Title: Growth rate of fractal copper electrodeposits: Potential and concentration effects
Author: Costa, J. M.
Sagués i Mestre, Francesc
Vilarrasa, M.
Keywords: Electroquímica
Deposició (Metal·lúrgia)
Electrochemistry
Plating
Issue Date: 1991
Publisher: The American Physical Society
Abstract: Experiments are reported on fractal copper electrodeposits. An electrochemical cell was designed in order to obtain a potentiostatic control on the quasi-two-dimensional electrodeposition process. The aim was focused on the analysis of the growth rate of the electrodeposited phase, in particular its dependence on the electrode potential and electrolyte concentration.
Note: Reproducció digital del document publicat en format paper, proporcionada per PROLA i http://dx.doi.org/10.1103/PhysRevA.43.7057
It is part of: Physical Review A, 1991, vol. 43, núm. 12, p. 7057-7060.
URI: http://hdl.handle.net/2445/9522
ISSN: 1050-2947
Appears in Collections:Articles publicats en revistes (Ciència dels Materials i Química Física)

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