Browsing by Subject Integrated circuit packaging
Showing results 1 to 2 of 2
| Issue Date | Title | Author(s) |
|---|---|---|
| 2000 | Residual thermomechanical stresses in thinned-chip assemblies | Leseduarte Cuevas, Sergio; Marco Colás, Santiago; Beyne, Eric; Van Hoof, Rita; Marty, Antoine; Pinel, Stèphane; Vendier, Olivier; Coello-Vera, Augustín |
| 1999 | A time-domain method for the analysis of thermal impedance response preserving the convolution form | Carmona Flores, Manuel; Marco Colás, Santiago; Palacín Roca, Jordi; Samitier i Martí, Josep |