Please use this identifier to cite or link to this item:
https://hdl.handle.net/2445/178779
Title: | Engineering grain boundaries at the 2D limit for the hydrogen evolution reaction |
Author: | He, Yongmin Tang, Pengyi Hu, Zhili He, Qiyuan Zhu, Chao Wang, Luqing Zeng, Qingsheng Golani, Prafful Gao, Guanhui Fu, Wei Huang, Zhiqi Gao, Caitian Xia, Juan Wang, Xingli Wang, Xuewen Ramasse, Quentin M. Zhang, Ao An, Boxing Zhang, Yongzhe Martí Sánchez, Sara Morante i Lleonart, Joan Ramon Wang, Liang Tay, Beng Kang Yakobson, Boris I. Trampert, Achim Zhang, Hua Wu, Minghong Wang, Qi Jie Arbiol i Cobos, Jordi Liu, Zheng |
Keywords: | Electrocatàlisi Materials Electrocatalysis Materials |
Issue Date: | 2-Jan-2020 |
Publisher: | Nature Publishing Group |
Abstract: | Atom-thin transition metal dichalcogenides (TMDs) have emerged as fascinating materials and key structures for electrocatalysis. So far, their edges, dopant heteroatoms and defects have been intensively explored as active sites for the hydrogen evolution reaction (HER) to split water. However, grain boundaries (GBs), a key type of defects in TMDs, have been overlooked due to their low density and large structural variations. Here, we demonstrate the synthesis of wafer-size atom-thin TMD films with an ultra-high-density of GBs, up to ~1012 cm−2. We propose a climb and drive 0D/2D interaction to explain the underlying growth mechanism. The electrocatalytic activity of the nanograin film is comprehensively examined by micro-electrochemical measurements, showing an excellent hydrogen-evolution performance (onset potential: −25 mV and Tafel slope: 54 mV dec−1), thus indicating an intrinsically high activation of the TMD GBs. |
Note: | Reproducció del document publicat a: https://doi.org/10.1038/s41467-019-13631-2 |
It is part of: | Nature Communications, 2020, vol. 11, num. 57 |
URI: | https://hdl.handle.net/2445/178779 |
Related resource: | https://doi.org/10.1038/s41467-019-13631-2 |
ISSN: | 2041-1723 |
Appears in Collections: | Articles publicats en revistes (Enginyeria Electrònica i Biomèdica) |
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