Please use this identifier to cite or link to this item:
https://hdl.handle.net/2445/219733
Title: | A Review of Advances in Cold Spray Additive Manufacturing |
Author: | Vaz, Rodolpho Fernando Garfias Bulnes, Andrea Albaladejo-Fuentes, Vicente Sánchez, Javier García Cano, Irene |
Keywords: | Fabricació Impressió 3D Additius Manufacturing processes Three-dimensional printing Additives |
Issue Date: | 23-Jan-2023 |
Publisher: | MDPI |
Abstract: | Cold Spray Additive Manufacturing (CSAM) produces freeform parts by accelerating powder particles at supersonic speed which, impacting against a substrate material, trigger a process to consolidate the CSAM part by bonding mechanisms. The literature has presented scholars' efforts to improve CSAM materials' quality, properties, and possibilities of use. This work is a review of the CSAM advances in the last decade, considering new materials, process parameters optimization, post-treatments, and hybrid processing. The literature considered includes articles, books, standards, and patents, which were selected by their relevance to the CSAM theme. In addition, this work contributes to compiling important information from the literature and presents how CSAM has advanced quickly in diverse sectors and applications. Another approach presented is the academic contributions by a bibliometric review, showing the most relevant contributors, authors, institutions, and countries during the last decade for CSAM research. Finally, this work presents a trend for the future of CSAM, its challenges, and barriers to be overcome. |
Note: | Reproducció del document publicat a: https://doi.org/10.3390/coatings13020267 |
It is part of: | Coatings, 2023 |
URI: | https://hdl.handle.net/2445/219733 |
Related resource: | https://doi.org/10.3390/coatings13020267 |
ISSN: | 2079-6412 |
Appears in Collections: | Articles publicats en revistes (Ciència dels Materials i Química Física) |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
255606.pdf | 2.51 MB | Adobe PDF | View/Open |
This item is licensed under a
Creative Commons License