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Si us plau utilitzeu sempre aquest identificador per citar o enllaçar aquest document: https://hdl.handle.net/2445/195364
Impact of the RF Power on the Copper Nitride Films Deposited in a Pure Nitrogen Environment for Applications as Eco-Friendly Solar Absorber
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This material can be considered to be an interesting eco-friendly choice to be used in the photovoltaic field. In this work, we present the fabrication of Cu3N thin films by reactive radio-frequency (RF) magnetron sputtering at room temperature, using nitrogen as the process gas. Dif-ferent RF power values ranged from 25 to 200 W and gas pressures of 3.5 and 5 Pa were tested to determine their impact on the film properties. The morphology and structure were exhaustively examined by Atomic Force Microscopy (AFM), Fourier Transform Infrared (FTIR) and Raman Spec-troscopies and X-ray Diffraction (XRD), respectively. The AFM micrographs revealed different mor-phologies depending on the total pressure used, and rougher surfaces when the films were depos-ited at the lowest pressure; whereas FTIR and Raman spectra exhibited the characteristics bands related to the Cu-N bonds of Cu3N. Such bands became narrower as the RF power increased. XRD patterns showed the (100) plane as the preferred orientation, that changed to (111) with the RF power, revealing a worsening in structural quality. Finally, the band gap energy was estimated from transmission spectra carried out with a Perkin Elmer 1050 spectrophotometer to evaluate the suita-bility of Cu3N as a light absorber. The values obtained demonstrated the capability of Cu3N for solar energy conversion applications, indicating a better film performance under the sputtering condi-tions 5.0 Pa and RF power values ranged from 50 to 100 W.
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RODRÍGUEZ-TAPIADOR, María isabel, MERINO, Jesús, JAWHARI, Tariq, MUÑOZ ROSAS, A. l., BERTOMEU I BALAGUERÓ, Joan, FERNÁNDEZ, Susana. Impact of the RF Power on the Copper Nitride Films Deposited in a Pure Nitrogen Environment for Applications as Eco-Friendly Solar Absorber. _Materials_. 2023. Vol. 16, núm. 4, pàgs. 1508-1-1508-19. [consulta: 23 de gener de 2026]. ISSN: 1996-1944. [Disponible a: https://hdl.handle.net/2445/195364]