Revealing Fast Cu-Ion Transport and Enhanced Conductivity at the CuInP2S6-In4/3P2S6 Heterointerface

dc.contributor.authorCheca Nualart, Martí
dc.contributor.authorJin, Xin
dc.contributor.authorMillán Solsona, Rubén
dc.contributor.authorNeumayer, Sabine M.
dc.contributor.authorSusner, Michael A.
dc.contributor.authorMcGuire, Michael A.
dc.contributor.authorO'Hara, Andrew
dc.contributor.authorGomila Lluch, Gabriel
dc.contributor.authorMaksymovych, Petro
dc.contributor.authorPantelides, Socrates T.
dc.contributor.authorCollins, Liam
dc.date.accessioned2023-05-02T08:55:48Z
dc.date.available2023-08-23T05:10:31Z
dc.date.issued2022-08-23
dc.date.updated2023-05-02T08:55:48Z
dc.description.abstractVan der Waals layered ferroelectrics, such as CuInP2S6 (CIPS), offer a versatile platform for miniaturization of ferroelectric device technology. Control of the targeted composition and kinetics of CIPS synthesis, enables the formation of stable self-assembled heterostructures of ferroelectric CIPS and non-ferroelectric In4/3P2S6 (IPS). Here, we use advanced quantitative scanning probe microscopy and density-functional-theory to explore in detail the nanoscale variability in dynamic functional properties of the CIPS-IPS heterostructure. We report evidence of fast ionic transport mediating an appreciable out-of-plane electromechanical response of CIPS in the paraelectric phase. Further, we map the local dielectric constant and ionic conductivity on the nanoscale as we thermally stimulate the ferroelectric-paraelectric phase transition, recovering the bulk dielectric peak of the transition at the nanoscale. Finally, we discover a conductivity enhancement at the CIPS/IPS interface, indicating the possibility of engineering its interfacial properties for next generation device applications.
dc.format.extent29 p.
dc.format.mimetypeapplication/pdf
dc.identifier.idgrec729157
dc.identifier.issn1936-0851
dc.identifier.urihttps://hdl.handle.net/2445/197427
dc.language.isoeng
dc.publisherAmerican Chemical Society
dc.relation.isformatofVersió postprint del document publicat a: https://doi.org/10.1021/acsnano.2c06992
dc.relation.ispartofACS Nano, 2022, vol. 16, num. 9, p. 15347-15357
dc.relation.urihttps://doi.org/10.1021/acsnano.2c06992
dc.rights(c) American Chemical Society , 2022
dc.rights.accessRightsinfo:eu-repo/semantics/openAccess
dc.sourceArticles publicats en revistes (Enginyeria Electrònica i Biomèdica)
dc.subject.classificationMicroscòpia electrònica d'escombratge
dc.subject.classificationNanotecnologia
dc.subject.classificationMicroscòpia de força atòmica
dc.subject.otherScanning electron microscopy
dc.subject.otherNanotechnology
dc.subject.otherAtomic force microscopy
dc.titleRevealing Fast Cu-Ion Transport and Enhanced Conductivity at the CuInP2S6-In4/3P2S6 Heterointerface
dc.typeinfo:eu-repo/semantics/article
dc.typeinfo:eu-repo/semantics/acceptedVersion

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