Copper underpotential deposition at gold surfaces in contact with a deep eutectic solvent: new insights

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dc.contributor.authorSebastián, Paula
dc.contributor.authorGómez, Elvira
dc.contributor.authorCliment Paya, Victor Jose
dc.contributor.authorFeliu, Juan M.
dc.date.accessioned2019-09-09T07:13:03Z
dc.date.available2019-09-09T07:13:03Z
dc.date.issued2017-03-31
dc.date.updated2019-09-09T07:13:03Z
dc.description.abstractCopper electrodeposition on polycrystalline gold electrode and on Au(hkl) single crystals was investigated in a deep eutectic solvent (DES). The employed DES consisted on a mix of choline chloride and urea (1:2). The interface Au(hkl) /DES was studied by using cycling voltammetry in the capacitive region. The blank voltammograms showed characteristic features, not previously reported, that demonstrates the surface sensitivity of this solvent. Afterwards, copper electrodeposition was analyzed, finding that it takes place through the formation of a UPD adlayer, evidencing the surface sensitivity of the phenomena. Voltammetric profiles showed similarities with those obtained in aqueous solutions containing chloride, suggesting that the copper UPD in this DES is strongly influenced by the presence of chloride.
dc.format.extent5 p.
dc.format.mimetypeapplication/pdf
dc.identifier.idgrec671078
dc.identifier.issn1388-2481
dc.identifier.urihttps://hdl.handle.net/2445/139539
dc.language.isoeng
dc.publisherElsevier B.V.
dc.relation.isformatofVersió postprint del document publicat a: https://doi.org/10.1016/j.elecom.2017.03.020
dc.relation.ispartofElectrochemistry Communications, 2017, vol. 78, p. 51-55
dc.relation.urihttps://doi.org/10.1016/j.elecom.2017.03.020
dc.rightscc-by-nc-nd (c) Elsevier B.V., 2017
dc.rights.accessRightsinfo:eu-repo/semantics/openAccess
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es
dc.sourceArticles publicats en revistes (Ciència dels Materials i Química Física)
dc.subject.classificationSolucions iòniques
dc.subject.classificationDissolvents
dc.subject.classificationCoure
dc.subject.classificationOr
dc.subject.otherIonic solutions
dc.subject.otherSolvents
dc.subject.otherCopper
dc.subject.otherGold
dc.titleCopper underpotential deposition at gold surfaces in contact with a deep eutectic solvent: new insights
dc.typeinfo:eu-repo/semantics/article
dc.typeinfo:eu-repo/semantics/acceptedVersion

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