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Treball de fi de grau

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cc-by-nc-nd (c) Carrión, 2020
Si us plau utilitzeu sempre aquest identificador per citar o enllaçar aquest document: https://hdl.handle.net/2445/176363

Thermal characterization of adhesive tape peeling: experiments and numerical modelling

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Resum

An experimental study of the two-dimensional temperature field evolution during the process of peeling an adhesive tape from a roll is presented. The measurements have been done using a thermographic infrared camera. The aim is to understand the heating process that is produced due to the fracture of the adhesive at different peeling velocities. Experimental data is numerically treated in order to correct the external noise and obtain time dependent temperature profiles along the peeling direction. A model based on the 1D Fourier equation with a moving boundary is proposed and solved numerically. We obtain good quantitative agreement that allows to estimate the heat production at the advancing fracture

Descripció

Treballs Finals de Grau de Física, Facultat de Física, Universitat de Barcelona, Curs: 2020, Tutor: Eduard Vives

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Citació

CARRIÓN SALAS, Gerard. Thermal characterization of adhesive tape peeling: experiments and numerical modelling. [consulta: 20 de gener de 2026]. [Disponible a: https://hdl.handle.net/2445/176363]

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