Thermal characterization of adhesive tape peeling: experiments and numerical modelling

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dc.contributor.advisorVives i Santa-Eulàlia, Eduard
dc.contributor.authorCarrión Salas, Gerard
dc.date.accessioned2021-04-16T13:07:06Z
dc.date.available2021-04-16T13:07:06Z
dc.date.issued2020-01
dc.descriptionTreballs Finals de Grau de Física, Facultat de Física, Universitat de Barcelona, Curs: 2020, Tutor: Eduard Vivesca
dc.description.abstractAn experimental study of the two-dimensional temperature field evolution during the process of peeling an adhesive tape from a roll is presented. The measurements have been done using a thermographic infrared camera. The aim is to understand the heating process that is produced due to the fracture of the adhesive at different peeling velocities. Experimental data is numerically treated in order to correct the external noise and obtain time dependent temperature profiles along the peeling direction. A model based on the 1D Fourier equation with a moving boundary is proposed and solved numerically. We obtain good quantitative agreement that allows to estimate the heat production at the advancing fractureca
dc.format.extent5 p.
dc.format.mimetypeapplication/pdf
dc.identifier.urihttps://hdl.handle.net/2445/176363
dc.language.isoengca
dc.rightscc-by-nc-nd (c) Carrión, 2020
dc.rights.accessRightsinfo:eu-repo/semantics/openAccessca
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es/*
dc.sourceTreballs Finals de Grau (TFG) - Física
dc.subject.classificationCinta adhesivacat
dc.subject.classificationAnàlisi tèrmicacat
dc.subject.classificationTreballs de fi de graucat
dc.subject.otherAdhesive tapeeng
dc.subject.otherThermal analysiseng
dc.subject.otherBachelor's theseseng
dc.titleThermal characterization of adhesive tape peeling: experiments and numerical modellingeng
dc.typeinfo:eu-repo/semantics/bachelorThesisca

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Treballs Finals de Grau (TFG) - Física