Excimer laser induced deposition of copper from Cu(hfac)(TMVS)

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dc.contributor.authorIzquierdo, Ricardo
dc.contributor.authorBertomeu i Balagueró, Joan
dc.contributor.authorSuys, Marc
dc.contributor.authorSacher, Edward
dc.contributor.authorMeunier, Michel
dc.date.accessioned2016-05-23T13:58:55Z
dc.date.available2016-05-23T13:58:55Z
dc.date.issued1995
dc.date.updated2016-05-12T13:28:06Z
dc.description.abstractCopper films have been deposited on TiN and fluoropolymer substrates from the KrF excimer-laser-assisted decomposition of Cu(hfac)(TMVS). Using H2 as the carrier gas, very uniform, shiny metal-like films were deposited with grain size of 50 to 100 nm. XPS measurements show that the precursor is reduced to metallic copper, and that a Cu/C atomic ratio of up to 17 is obtained.
dc.format.extent5 p.
dc.format.mimetypeapplication/pdf
dc.identifier.idgrec114375
dc.identifier.issn0169-4332
dc.identifier.urihttps://hdl.handle.net/2445/98759
dc.language.isoeng
dc.publisherElsevier B.V.
dc.relation.isformatofVersió postprint del document publicat a: http://dx.doi.org/10.1016/0169-4332(94)00439-0
dc.relation.ispartofApplied Surface Science, 1995, vol. 86, num. 1-4, p. 509-513
dc.relation.urihttp://dx.doi.org/10.1016/0169-4332(94)00439-0
dc.rights(c) Elsevier B.V., 1995
dc.rights.accessRightsinfo:eu-repo/semantics/openAccess
dc.sourceArticles publicats en revistes (Física Aplicada)
dc.subject.classificationCoure
dc.subject.classificationLàsers
dc.subject.classificationPel·lícules metàl·liques
dc.subject.otherCopper
dc.subject.otherLasers
dc.subject.otherMetallic films
dc.titleExcimer laser induced deposition of copper from Cu(hfac)(TMVS)
dc.typeinfo:eu-repo/semantics/article
dc.typeinfo:eu-repo/semantics/acceptedVersion

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