Document type
ArticleVersion
Accepted versionPublication date
All rights reserved
Please use this identifier to cite or link to this item: https://hdl.handle.net/2445/98759
Excimer laser induced deposition of copper from Cu(hfac)(TMVS)
Journal Title
Director/Tutor
Journal ISSN
Volume Title
Related resource
Abstract
Copper films have been deposited on TiN and fluoropolymer substrates from the KrF excimer-laser-assisted decomposition of Cu(hfac)(TMVS). Using H2 as the carrier gas, very uniform, shiny metal-like films were deposited with grain size of 50 to 100 nm. XPS measurements show that the precursor is reduced to metallic copper, and that a Cu/C atomic ratio of up to 17 is obtained.
Subject
Subject (English)
Citation
Citation
IZQUIERDO, Ricardo, et al. Excimer laser induced deposition of copper from Cu(hfac)(TMVS). Applied Surface Science. 1995. Vol. 86, num. 1-4, pags. 509-513. ISSN 0169-4332. [consulted: 6 of June of 2026]. Available at: https://hdl.handle.net/2445/98759